­ Package Footprint: 76 Pins, 0.6-mm Pitch, x 8.10-mm mrQFN Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking) ­ Class 1.5 TX Power to +12 dBm ­ Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required ­ Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time ­ Provides Longer Range, Including 2x Range Over Other BLE-Only Solutions ­ ROM Spin to Enable Offload Host and Save Current With Assisted Audio (SBC Encode and Decode On Chip) Advanced Power Management for Extended Battery Life and Ease of Design: ­ On-Chip Power Management, Including Direct Connection to Battery ­ Low Power Consumption for Active, Standby, and Scan Bluetooth Modes ­ Shutdown and Sleep Modes to Minimize Power Consumption Physical Interface: ­ Fully Programmable Digital PCM-I2S Codec Interface CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack Device Pin-to-Pin Compatible With Previous Devices or Modules

Single-Chip Bluetooth Solution Integrating Bluetooth Basic Rate (BR)/Enhanced Data Rate (EDR)/Low Energy (LE) Features Fully Compliant With the Bluetooth 4.0 Specification Up to the HCI Layer BR/EDR Features Include: to 7 Active Devices ­ Scatternet: to 3 Piconets Simultaneously, 1 as Master and 2 as Slaves to 2 SCO Links on the Same Piconet ­ Support for All Voice Air-Coding ­ Continuously Variable Slope Delta (CVSD), A-Law, -Law, and Transparent (Uncoded) CC2560B/CC2564B Devices Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power LE Features Include: ­ Support 10 (CC2564 and CC2564B) Simultaneous Connections ­ Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption ­ Independent Buffering for LE Allows Large Numbers of Multiple Connections Without Affecting BR/EDR Performance. ­ Built-In Coexistence and Prioritization Handling for BR/EDR and LE Flexibility for Easy Stack Integration and Validation Into Various Microcontrollers, Such as MSP430TM and ARM® CortexTM-M3 and CortexTM-M4 MCUs Highly Optimized for Low-Cost Designs: ­ Single-Ended 50- RF Interface

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. MSP430, DRP are trademarks of Texas Instruments. Cortex is a trademark of ARM Limited. is a registered trademark of ARM Limited. ARM is a registered trademark of ARM Physical IP, Inc. iPod is a registered trademark of Apple, Inc. Bluetooth is a registered trademark of Bluetooth SIG, Inc.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI's seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that supports Bluetooth 4.0 dual-mode (BR/EDR/LE) protocols. When coupled with a microcontroller unit (MCU), the HCI device provides best-in-class RF performance. TI's power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation. With transmit power and receive sensitivity, this solution provides a best-in-class range of about 2x, compared to other BLE-only solutions. A royalty-free software Bluetooth stack available from TI is preintegrated with TI's MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. The stack is also available for made for iPod® (MFi) solutions and on other MCUs through TI's partner Stonestreet One (www.stonestreetone.com). Some of the profiles supported today include: serial port profile (SPP), advanced audio distribution profile (A2DP), human interface device (HID), and several BLE profiles (these profiles vary based on the supported MCU). In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions. For more information on TI's wireless platform solutions for Bluetooth, see TI's Wireless Connectivity Wiki (processors.wiki.ti.com/index.php/CC256x). Table 1-1 lists the CC256x family members. Table 1-1. CC256x Family Members

The assisted modes (HFP 1.6 and A2DP) are not supported simultaneously. Furthermore, the assisted modes are not supported simultaneously with BLE or ANT. The device does not support simultaneous operation of LE and ANT.

Note: The following technologies and assisted modes cannot be used simultaneously with the coprocessor: LE, ANT, assisted HFP 1.6 (WBS), and assisted A2DP. One and only one technology or assisted mode can be used at a time.

1.1 Features............................................. 1.2 Applications.......................................... 1.3 Description........................................... 1.4 Functional Block Diagram........................... Revision History.............................................. 2 Bluetooth................................................. 2.1 BR/EDR Features.................................... 2.2 LE Features..........................................

General Device Requirements and Operation..... Bluetooth BR/EDR RF Performance............... Bluetooth LE RF Performance..................... Interface Specifications.............................

Reference Design and BOM for Power and Radio Connections............................................ 37 mrQFN Mechanical Data............................. 38 Chip Packaging and Ordering...................... 40

6 Detailed Description.................................... 7 3.1 Pin Designation...................................... 7 3.2 Terminal Functions.................................. 8 3.3 Device Power Supply............................... 10 3.4 Clock Inputs........................................ 12 3.5 Functional Blocks................................... 15

Device Quantity and Direction...................... Insertion of Device................................. Tape Specification.................................. Reel Specification.................................. Packing Method.................................... Packing Specification...............................

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